Customization: | Available |
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Application: | Artificial Intelligence, Automotive Electronics, Consumer Electronics, Industry, Integrated Circuit, Solar Cell |
Conductivity Type: | Bipolar Conduction |
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PrimePACK™ 3 1700 V, 1000 A half bridge dual IGBT module with TRENCHSTOP™ IGBT4, NTC and fast switching chip. Also available with pre-applied Thermal Interface Material.
Summary of Features
Benefits
Parametrics | FF1000R17IE4 |
Configuration | Dual |
Dimensions (width) | 89 mm |
Dimensions (length) | 250 mm |
Housing | PrimePACK™ 3 |
IC(nom) / IF(nom) | 1000 A |
IC max | 1000 A |
Qualification | Industrial |
Technology | IGBT4 - E4 |
VCE(sat) (Tvj=25°C typ) | 2 V |
VCES / VRRM | 1700 V |
VF (Tvj=25°C typ) | 1.85 V |
Voltage Class max | 1700 V |
ales Product Name | FF1000R17IE4 |
OPN | FF1000R17IE4BOSA1 |
Product Status | active and preferred |
Infineon Package name | AG-PRIME3 |
Standard Package name | |
Completely lead free | no |
Halogen free | no |
RoHS compliant | yes |
Packing Size | 2 |
Packing Type | TRAY |
Moisture Level | NA |
Moisture Packing | NON DRY |